DOI: 10.1016/j.diin.2019.04.003
Paper Summary:
Title: Removing epoxy underfill between neighbouring components using acid for component chip-off
Author(s): Heckmann, Th; McEvoy, J.P.; Markantonakis, K.; Akram, R.N.; Naccache, D.
Year: 2019
DOI: 10.1016/j.diin.2019.04.003
URL: https://doi.org/10.1016/j.diin.2019.04.003
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Received on: 2024-10-17
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